Rigid CCL Market: June 2026 Update —AI Infrastructure Drives Continued Growth

Prismark estimates that the rigid PCB laminate market sustained strong momentum in 2025, continuing the recovery that began in 2024. Growth was largely driven by demand from AI servers, high-performance computing, advanced networking equipment, and data center infrastructure. These applications supported both higher shipment volumes and broader adoption of high-performance laminate materials.

The rigid copper clad laminate market, excluding flex and mass laminate but including prepreg, reached approximately $18.7Bn in 2025, representing a 24.4% increase from $15.0Bn in 2024. This marked the second consecutive year of robust growth following the market downturn in 2023.

A key feature of the 2025 market was the continued expansion of high-performance materials. Suppliers serving AI-related applications posted the strongest growth, particularly those focused on high-speed, low-loss, and ultra-low-loss laminate technologies. As AI server architectures became more complex and networking speeds continued to rise, demand accelerated for advanced materials capable of supporting higher signal integrity requirements and greater layer counts.

Growth, however, was not evenly distributed across the market. Suppliers with strong exposure to AI servers, advanced networking, and high-performance computing generally outperformed those more heavily focused on conventional FR-4 applications. As a result, supplier rankings increasingly reflected the impact of AI-driven demand and the growing importance of advanced laminate technologies.

PCB RIGID LAMINATE SUPPLIER REVENUE – 2025

EMC further strengthened its position as the industry’s leading supplier in 2025, generating approximately $3.03Bn in sales and capturing a 16.2% share of the global market. The company widened its lead over traditional market leaders as investment in AI infrastructure accelerated throughout the year.

Shengyi Technology, also known as SYTECH, remained the second-largest supplier, with sales of $2.47Bn, while Kingboard retained third place with $2.31Bn. Together, EMC, SYTECH, and Kingboard accounted for more than 40% of the global rigid laminate market. The graphic above highlights the increasing revenue concentration among suppliers with strong exposure to high-performance computing and AI-related applications.

Market concentration remained high in 2025, as the largest laminate manufacturers continued to benefit from scale, technology leadership, and established relationships across the AI and data center supply chain. EMC, SYTECH, Kingboard, and Nan Ya Plastics remained the four largest suppliers globally.

EMC’s rapid growth materially reshaped the competitive landscape, while Doosan’s rise into the top tier underscored the growing importance of advanced substrate and specialty laminate applications. These shifts indicate that competitive advantage in the rigid laminate market is increasingly tied to suppliers’ ability to support advanced, high-performance applications rather than conventional laminate demand alone.

The outlook for the rigid CCL market remains positive, supported by continued global investment in AI infrastructure, cloud computing, advanced networking, and data center expansion. While traditional PCB applications are expected to remain an important part of overall demand, future growth is becoming increasingly linked to AI systems and the high-performance electronic platforms that enable them.

As a result, suppliers with advanced material portfolios are expected to be the primary beneficiaries of the market’s next phase of growth. This is particularly true for companies with strong capabilities in high-speed, low-loss, ultra-low-loss, and specialty laminate materials, which are increasingly required to support higher data rates, improved signal integrity, and more complex system architectures.